WAFER SEGMENT DIAMOND BLADE

A wafer segment diamond blade is a specialized type of cutting blade that is used to cut through a variety of materials. It is most commonly used to cut through hard materials, such as concrete, brick, and stone. The blade is made up of a diamond-tipped segment that is attached to a steel base. The blade is designed to be able to cut through materials quickly and efficiently, and the segment allows for a smooth cut.

Categories: All products,Diamond saw blade,Sintered diamond blade,Silver brazed diamond blade , Flexible polishing pad

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A wafer segment diamond blade is a specialized type of cutting blade that is used to cut through a variety of materials. It is most commonly used to cut through hard materials, such as concrete, brick, and stone. The blade is made up of a diamond-tipped segment that is attached to a steel base. The blade is designed to be able to cut through materials quickly and efficiently, and the segment allows for a smooth cut.

Categories: All products,Diamond saw blade,Sintered diamond blade,Silver brazed diamond blade , Flexible polishing pad

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Get quick quote from us:
We need more detail as follow. This will allow us to give you an accurate quotation.
Before offer the price,get the quote simply by completing and submitting the form below:
•Application:_______________ ( concrete ,asphalt , granite,,marble, tile , etc )

•Diameter: ___________(inch/mm)
• Segment height: _______(inch/mm)

• Arbor hole size: __________(inch/mm)
• Order Quantity: _________________pcs
• Technology: _________________ (Hot pressed, Cold sintered , Brazed , Laser welded)
• Where to Shipping: _______________ (Country /port)

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